AMS at NEPCON Vietnam 2026
At NEPCON Vietnam 2026, the AMS booth showcased thermal management materials, electronic adhesives and automated dispensing solutions, drawing strong interest from engineers at electronics and component plants.
NEPCON is a well-established annual event for the electronics manufacturing industry, where suppliers of SMT equipment, materials and inspection solutions meet customers. This year, AMS brought a booth focused on solving thermal and reliability challenges for next-generation electronic devices.
Thermal materials for high-power devices
The first display area focused on thermal interface materials: ultra-soft gap pads for camera modules and telecom equipment, liquid gap fillers for chargers and inverters, and greases and phase change materials for processors. Visitors could feel the softness of the pads and compare samples after thermal cycling.
Electronic adhesives for board assembly
- Underfill adhesives that reinforce BGA components against drop and thermal cycling.
- UV and dual-cure adhesives for component fixing and camera lens bonding.
- Conformal coatings with fluorescent tracers.
- Potting compounds to protect power supplies and outdoor sensors.
Automated dispensing demonstration
The highlight of the booth was a model dispensing station with an integrated UV curing lamp, illustrating the dispensing, curing and inspection process in a short cycle. AMS engineers explained how to select jetting valves, control the dispensed volume and integrate bead inspection cameras to reduce defects on the line.
Many visitors came to the booth not asking about a specific product but bringing a problem: components running too hot, adhesive spreading, boards failing after humidity testing. Those are the conversations we enjoy most. — AMS Application Engineer at the booth
Direct consultation and samples
Throughout the exhibition, AMS set up a dedicated consultation area where plant engineers could discuss their applications in detail. Many requests for samples and line surveys were recorded and will be followed up by the technical team after the event.
Connecting after the exhibition
After the event, AMS compiled the most frequently asked questions into short technical documents sent to visitors. Plants with specific requirements will be scheduled for on-site working sessions, with AMS bringing samples and measuring equipment to test directly on real products rather than relying only on documentation. This approach significantly shortens the time from the initial discussion to finalizing the material.
If you did not get a chance to visit the booth, contact AMS Vietnam to receive product brochures and request samples.
