AMS joins Vietnam's semiconductor supply chain
AMS Vietnam has officially expanded its portfolio of semiconductor packaging and test materials to meet the needs of OSAT and chip assembly plants newly invested in northern Vietnam. This move continues the company's long-standing strategy of supporting the electronics industry.
The wave of investment in semiconductor packaging, testing and assembly in Vietnam is creating strong demand for specialty materials with very stringent requirements for cleanliness, traceability and lot-to-lot consistency. AMS has prepared its people, warehousing and quality system to take part in this supply chain.
Expanded material portfolio
In addition to its existing range of adhesives, tapes and thermal materials, AMS is adding a group of materials dedicated to chip packaging:
- Electrically conductive and insulating die attach adhesives for die bonding.
- Capillary underfill and no-flow underfill for flip chip.
- UV tapes for wafer dicing and backgrinding.
- Thermal interface materials for power modules and processors.
- Fine-pitch solder paste and flux for SiP assembly.
On-site technical support capabilities
The AMS application engineering team, trained by the material manufacturers, can support sample trials, optimize dispensing parameters and carry out basic failure analysis right at the customer's plant. The company's laboratory has been equipped with viscosity measurement, adhesion testing and thermal cycling chambers to shorten material evaluation time.
The semiconductor industry does not tolerate lot-to-lot variation. We have built our receiving, cold storage and delivery processes so that every lot of material reaches our customers with the same quality as when it left the manufacturer.
Quality Department Representative, AMS Vietnam
Cold storage and traceability records
The warehouse system serving the Bac Ninh, Bac Giang and Hai Phong industrial parks is equipped with -40°C and 0–10°C storage zones with continuous temperature monitoring. Each shipment comes with a certificate of analysis (COA), production lot number and expiration date, meeting the plant's incoming material control requirements.
Looking ahead
AMS will continue working with material manufacturers to bring in more solutions for advanced packaging and SiC power modules, while also organizing technical sharing sessions for process engineers in the industry.
At the same time, AMS is ready to collaborate with technical universities and training centers to share practical knowledge about packaging materials, helping prepare the workforce for the industry.
Semiconductor plants looking for a reliable material supply can contact AMS Vietnam to receive the detailed catalog and sample trial schedule.
