Seminar: Thermal solutions for next-generation electronics
This AMS seminar explores trends in thermal management materials for high-power electronic devices such as fast chargers, inverters, servers and next-generation telecom equipment. The program is designed for thermal design engineers and process engineers.
Power density per square centimeter of circuit board has risen rapidly in recent years. SiC and GaN semiconductors enable faster switching but also generate more concentrated heat. Without effective heat dissipation, junction temperatures exceeding their limits will shorten component life exponentially.
Seminar program
- Fundamentals of thermal resistance and how to calculate the thermal path.
- Comparison of thermal interface materials: greases, pads, adhesives and phase change materials.
- Trends in high-conductivity materials above 10 W/m.K.
- Automated dispensing solutions for thermal compounds on the production line.
Thermal interface material reference table
| Type | Typical thermal conductivity | Bond line thickness | Advantages |
|---|---|---|---|
| Thermal grease | 1–6 W/m.K | 20–50 µm | Lowest thermal resistance |
| Gap pad | 1–12 W/m.K | 0.25–5 mm | Absorbs large tolerances |
| Liquid gap filler | 2–7 W/m.K | 0.2–3 mm | Easy to automate |
| Thermally conductive adhesive | 1–3 W/m.K | 0.1–0.3 mm | Bonds and dissipates heat at the same time |
Hands-on practice and measurement
The hands-on session lets engineers measure the thermal resistance of material samples on a standard test rig and observe thermal images of a circuit board as materials are changed. Participants will clearly see the effects of compression force, surface flatness and grease pump-out after repeated thermal cycles.
Attendee benefits
Attendees will receive a thermal material sample kit and seminar materials, plus priority simulation or testing support for specific projects after the program.
The final session of the seminar is an open discussion where engineers share thermal problems they have encountered at their factories: thermal grease drying out after a year of operation, gap pads tearing during automated assembly, or thermally conductive adhesive delaminating after thermal shock testing. AMS specialists analyze the causes based on material properties and assembly conditions and suggest test approaches to confirm them. In many cases, simply changing screw torque or assembly sequence has lowered component temperatures by several degrees Celsius.
Places for the hands-on session are limited, with priority given to engineers who register early and have projects in the design phase.
To register for the seminar or book a thermal management consultation, please contact AMS Vietnam.
