Coupling agent that improves adhesion between inorganic and organic materials; treats silica, glass and talc fillers; primer additive for adhesives
Fast bonding of rubber, plastics and metals exposed to impact and vibration: gaskets, keypads, belts, housings and production line fixtures
Stencil printed for reflow soldering of SMD, BGA and QFN components on consumer, automotive, telecom and industrial circuit boards
Bonds heat sinks to chips and boards; mounts LED strips and backlights to metal frames; replaces clips and screws
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