G-747 thermal grease

Shin-Etsu G-747 Thermal Grease is a one-component, non-curing thermally conductive silicone grease used to fill microscopic gaps between the base of power components and heat sinks. Thanks to its stable silicone base oil and evenly dispersed metal oxide filler, G-747 forms a thin interface layer with low thermal resistance and maintains stable properties over the long term, with minimal oil bleed and no drying out.

Typical Applications

• Thermal interface between CPUs, GPUs and heat sinks
• IGBT and thyristor modules in inverters, welding machines and UPS systems
• High-power LED chip bases and lighting drivers
• Power transistors and diodes in switch-mode power supplies
• Controllers and chargers in electric vehicles

Advantages

1. Penetration suited to screen printing and automatic dispensing equipment
2. Non-curing, making disassembly easy for maintenance and component replacement
3. Low oil bleed, does not contaminate the board or surrounding components
4. Good electrical insulation, safe in contact with component leads

Key Specifications

Application Notes

Clean the component and heat sink surfaces with isopropyl alcohol before applying. Apply a thin, even layer of about 50–100 µm; an overly thick layer increases thermal resistance. Tighten screws evenly in a diagonal pattern to the component manufacturer's recommended torque so the grease spreads uniformly and all air bubbles are expelled.

Using a screen or stencil sized to the module base ensures a consistent grease layer from part to part and saves material.

Contact the technical team at AMS Vietnam for advice on tube and pail packaging and automatic dispensing solutions.