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Two-part thermal adhesive

Applications

Bonds and conducts heat for battery cells, power modules, current sensors, inductors and aluminum heat sinks in chargers and inverters

Properties

Conductivity 2.0 W/m·K / Mix ratio 1:1 / Working time 60 min / Shear strength 8 MPa / Service range -40 to 150 °C

Storage

5–25 °C, keep sealed, stir before use

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Product description

Henkel Two-Component Thermal Adhesive is a thermally conductive structural adhesive based on modified epoxy that both creates a strong mechanical bond and conducts heat from components to the heat sink. It is ideal for designs that eliminate clips and screws holding components, enabling more compact assemblies and greater reliability under vibration in power and battery equipment.

Typical Applications

  • Bonding battery cells to cooling plates in EV and electric motorcycle battery modules
  • Mounting transistors and power diodes onto aluminum heat sinks without screws
  • Securing inductors and small transformers in chargers and switch-mode power supplies
  • Bonding temperature sensors to busbars and battery cells
  • Bonding LED bases to heat sinks in industrial lighting fixtures

Advantages

  1. Provides both structural bonding and heat transfer, reducing the number of mechanical parts
  2. 1:1 mix ratio is convenient for dual cartridges and automatic meter-mix equipment
  3. Cures at room temperature, or can be heated to 80 °C to shorten production cycle time
  4. Electrically insulating, low shrinkage, with excellent thermal shock and vibration resistance

Key Specifications

PropertyValue
Thermal conductivity2.0 W/m·K
Mixed viscosityapprox. 60,000 mPa·s
Working time60 minutes at 25 °C
Cure24 hours at 25 °C or 1 hour at 80 °C
Shear strength on aluminum8 MPa
Cured hardness80 Shore D

Application Notes

Stir each component separately before mixing, as the ceramic filler may settle. Use a static mixing nozzle or mix by hand until the color is uniform, avoiding air entrapment. Aluminum surfaces should be degreased and lightly abraded to improve adhesion. The optimal bond line thickness is 0.1 to 0.3 mm; an overly thick layer increases thermal resistance.

When using dual cartridges, purge about 3–5 cm of adhesive from the mixing nozzle to ensure an accurate mix ratio before dispensing onto the part.

Contact the technical team at AMS Vietnam for advice on packaging options, dispensing equipment and testing on your actual parts.

Technical properties

Product typeThermally conductive structural adhesive
BrandHenkel
ChemistryCeramic-filled modified epoxy
ColorPart A white, Part B gray; light gray when mixed
Components2
Mix ratio1:1 by volume
Thermal conductivity2.0 W/m·K
Mixed viscosityapprox. 60,000 mPa·s
Working time60 minutes at 25 °C
Shear strength on aluminum8 MPa
Hardness80 Shore D
Maximum temperature150 °C
Minimum temperature-40 °C
StandardsRoHS, REACH

Documents

Two-part thermal adhesive
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