Silicone thermal pad

Bergquist Silicone Thermal Pad is a soft sheet-form thermal interface material consisting of a silicone matrix filled with thermally conductive ceramic particles, used to fill the gap between components and heat sinks. Thanks to its high softness, the pad conforms closely to surfaces with varying height tolerances without placing significant stress on components, while providing electrical insulation between components and metal enclosures.

Typical Applications

• Transferring heat from MOSFETs, IGBTs and inductors to the aluminum housings of power supplies and inverters
• Cooling battery cells and BMS circuits in EV battery modules and energy storage systems
• Filling the gap between chips and heat spreaders in networking equipment and telecom base stations
• Cooling driver boards and high-power LED chips
• Thermal gap filling for ECUs, cameras and radar in automobiles

Advantages

1. Wide thermal conductivity range of 1.5–6 W/m·K, making it easy to match the grade to the heat load
2. High softness with 20–40% compressibility, providing excellent assembly tolerance compensation
3. Electrically insulating and flame retardant, replacing mica sheets and thermal grease
4. Clean application, available pre-cut to shape, and removable for maintenance

Key Specifications

Application Notes

Select a pad thickness about 10–20% greater than the actual gap to achieve proper compression. Remove the protective film from one side, place the pad on the component, then remove the other film and mount the heat sink; avoid stretching the pad or allowing dust onto its surface. Do not compress beyond 50% of the thickness to avoid excessive force on component solder joints.

Higher thermal conductivity is not always better: for large gaps, a softer pad that compresses more often delivers lower overall thermal resistance.

Contact the technical team at AMS Vietnam for advice on thermal conductivity grade selection, die-cutting to your drawings and samples for thermal testing.